ICM7555IN Datasheet, PDF (19/22 Pages) NXP Semiconductors – General purpose CMOS timer

NXP Semiconductors
ICM7555
General purpose CMOS timer
14.4 Package related soldering information
Table 8. Suitability of through-hole mount IC packages for dipping and wave soldering
Package
Soldering method
Dipping
Wave
CPGA, HCPGA
-
suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL
suitable
suitable^[1]
PMFP^[2]
-
not suitable
[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
[2] For PMFP packages hot bar soldering or manual soldering is suitable.
15. Abbreviations
Table 9. Abbreviations
Acronym
Description
CMOS
Complementary Metal-Oxide Semiconductors
TTL
Transistor-Transistor Logic
SCR
Silicon-Controlled Rectifier
ICM7555_2
Product data sheet
Rev. 02 — 3 August 2009
© NXP B.V. 2009. All rights reserved.
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