GTL2005 Datasheet, PDF (19/19 Pages) NXP Semiconductors – Quad GTL/GTL to LVTTL/TTL bidirectional non-latched translator

NXP Semiconductors
GTL2005
Quad GTL/GTL+ to LVTTL/TTL bidirectional non-latched translator
19. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
4
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
5
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
6
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
6.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
7
Functional description . . . . . . . . . . . . . . . . . . . 4
7.1
Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 4
8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
9
Recommended operating conditions. . . . . . . . 6
10
Static characteristics. . . . . . . . . . . . . . . . . . . . . 7
10.1
Performance curves . . . . . . . . . . . . . . . . . . . . . 8
11
Dynamic characteristics . . . . . . . . . . . . . . . . . 11
11.1
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
12
Test information . . . . . . . . . . . . . . . . . . . . . . . . 12
13
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13
14
Soldering of SMD packages . . . . . . . . . . . . . . 14
14.1
Introduction to soldering . . . . . . . . . . . . . . . . . 14
14.2
Wave and reflow soldering . . . . . . . . . . . . . . . 14
14.3
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 14
14.4
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 15
15
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16
16
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 17
17
Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
17.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18
17.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
17.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
17.4
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
18
Contact information. . . . . . . . . . . . . . . . . . . . . 18
19
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Date of release: 3 February 2009
Document identifier: GTL2005_7