OPA2830 Datasheet, PDF (32/43 Pages) National Semiconductor (TI) – Dual, Low-Power, Single-Supply, Wideband OPERATIONAL AMPLIFIER

OPA2830
SBOS309D – AUGUST 2004 – REVISED AUGUST 2008.................................................................................................................................................. www.ti.com
bandlimiting. To reduce unwanted capacitance, a
window around the signal I/O pins should be opened
in all of the ground and power planes around those
pins. Otherwise, ground and power planes should be
unbroken elsewhere on the board.
b) Minimize the distance ( < 0.25") from the
power-supply pins to high-frequency 0.1µF
decoupling capacitors. At the device pins, the ground
and power-plane layout should not be in close
proximity to the signal I/O pins. Avoid narrow power
and ground traces to minimize inductance between
the pins and the decoupling capacitors. Each
power-supply connection should always be
decoupled with one of these capacitors. An optional
supply decoupling capacitor (0.1µF) across the two
power supplies (for bipolar operation) will improve
2nd-harmonic distortion performance. Larger (2.2µF
to 6.8µF) decoupling capacitors, effective at lower
frequency, should also be used on the main supply
pins. These may be placed somewhat farther from
the device and may be shared among several
devices in the same area of the PC board.
c) Careful selection and placement of external
components will preserve the high-frequency
performance. Resistors should be a very low
reactance type. Surface-mount resistors work best
and allow a tighter overall layout. Metal film or carbon
composition axially-leaded resistors can also provide
good high-frequency performance. Again, keep their
leads and PC board traces as short as possible.
Never use wire-wound type resistors in a
high-frequency application. Since the output pin and
inverting input pin are the most sensitive to parasitic
capacitance, always position the feedback and series
output resistor, if any, as close as possible to the
output pin. Other network components, such as
noninverting input termination resistors, should also
be placed close to the package. Where double-side
component mounting is allowed, place the feedback
resistor directly under the package on the other side
of the board between the output and inverting input
pins. Even with a low parasitic capacitance shunting
the external resistors, excessively high resistor values
can create significant time constants that can
degrade performance. Good axial metal film or
surface-mount resistors have approximately 0.2pF in
shunt with the resistor. For resistor values > 1.5kΩ,
this parasitic capacitance can add a pole and/or zero
below 500MHz that can effect circuit operation. Keep
resistor values as low as possible consistent with
load driving considerations. The 750Ω feedback used
in the Typical Characteristics is a good starting point
for design.
d) Connections to other wideband devices on the
board may be made with short direct traces or
through onboard transmission lines. For short
connections, consider the trace and the input to the
next device as a lumped capacitive load. Relatively
wide traces (50mils to 100mils) should be used,
preferably with ground and power planes opened up
around them. Estimate the total capacitive load and
set R_S from the typical characteristic curve
Recommended R_S vs Capacitive Load. Low parasitic
capacitive loads (< 5pF) may not need an R_S since
the OPA2830 is nominally compensated to operate
with a 2pF parasitic load. Higher parasitic capacitive
loads without an R_S are allowed as the signal gain
increases (increasing the unloaded phase margin). If
a long trace is required, and the 6dB signal loss
intrinsic to a doubly-terminated transmission line is
acceptable, implement a matched impedance
transmission line using microstrip or stripline
techniques (consult an ECL design handbook for
microstrip and stripline layout techniques). A 50Ω
environment is normally not necessary onboard, and
in fact, a higher impedance environment will improve
distortion as shown in the distortion versus load plots.
With a characteristic board trace impedance defined
(based on board material and trace dimensions), a
matching series resistor into the trace from the output
of the OPA2830 is used as well as a terminating
shunt resistor at the input of the destination device.
Remember also that the terminating impedance will
be the parallel combination of the shunt resistor and
the input impedance of the destination device; this
total effective impedance should be set to match the
trace impedance. If the 6dB attenuation of a
doubly-terminated transmission line is unacceptable,
a long trace can be series-terminated at the source
end only. Treat the trace as a capacitive load in this
case and set the series resistor value as shown in the
typical characteristic curve Recommended R_S vs
Capacitive Load. This will not preserve signal integrity
as well as a doubly-terminated line. If the input
impedance of the destination device is low, there will
be some signal attenuation due to the voltage divider
formed by the series output into the terminating
impedance.
e) Socketing a high-speed part is not
recommended. The additional lead length and
pin-to-pin capacitance introduced by the socket can
create an extremely troublesome parasitic network
which can make it almost impossible to achieve a
smooth, stable frequency response. Best results are
obtained by soldering the OPA2830 onto the board.
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