UPD784224 Datasheet, PDF (84/92 Pages) NEC – 16/8-BIT SINGLE-CHIP MICROCONTROLLERS

µPD784224, 784225, 784224Y, 784225Y
16. RECOMMENDED SOLDERING CONDITIONS
The µPD784225 should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact your NEC sales representative.
Caution Soldering conditions for the µPD784224GC-×××-8BT, µPD784225YGC-×××-8BT, and µPD784225YGK-
×××-9EU are undetermined because these products are under development.
Table 16-1. Soldering Conditions for Surface Mount Type
(1) µPD784225GC-×××-8BT: 80-pin plastic QFP (14 × 14 mm)
Soldering Method
Infrared reflow
VPS
Wave soldering
Partial heating
Soldering Conditions
Recommended
Condition Symbol
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or
higher), Count: Two times or less, Exposure limit: 7 days^Note (after that,
prebake at 125°C for 20 hours)
IR35-00-2
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or
higher), Count: Two times or less, Exposure limit: 7 days^Note (after that,
prebake at 125°C for 20 hours)
VP15-00-2
Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
—
Preheating temperature: 120°C max. (package surface temperature)
Exposure limit: 7 days^Note (after that, prebake at 125°C for 20 hours)
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
—
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
(2) µPD784224GK-×××-9EU: 80-pin plastic TQFP (fine pitch) (14 × 20 mm)
µPD784225GK-×××-9EU: 80-pin plastic TQFP (fine pitch) (14 × 20 mm)
Soldering Method
Infrared reflow
VPS
Wave soldering
Partial heating
Soldering Conditions
Recommended
Condition Symbol
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or
higher), Count: Two times or less, Exposure limit: 7 days^Note (after that,
prebake at 125°C for 20 hours)
IR35-103-2
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or
higher), Count: Two times or less, Exposure limit: 7 days^Note (after that,
prebake at 125°C for 20 hours)
VP15-103-2
Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
—
Preheating temperature: 120°C max. (package surface temperature)
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
—
Caution Do not use different soldering methods together (except for partial heating).
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Data Sheet U12376EJ1V0DS00