UPD78P4916 Datasheet, PDF (47/56 Pages) NEC – 16-BIT SINGLE-CHIP MICROCONTROLLER

µPD78P4916
7. RECOMMENDED SOLDERING CONDITIONS
*
This device should be soldered and mounted under the following conditions.
For details about the recommended conditions, refer to the document “Semiconductor Device Mounting
Technology Manual” (C10535E). For soldering methods and conditions other than those recommended below,
contact your NEC sales representative.
Table 7-1. Surface Mounting Type Soldering Conditions
µPD78P4916GF-3BA: 100-pin plastic QFP (14 x 20 mm)
Soldering Method
Soldering Conditions
Symbol
Infrared rays reflow
Peak package's surface temperature: 235 ˚C, Reflow time: 30 seconds or less
(at 210 ˚C or higher), Number of reflow processes: 2 or less
<Attention>
(1) Wait for the device temperature to come down to room temperature
after the first reflow before starting the second reflow.
(2) Do not perform flux cleaning of the soldered portion after the first reflow.
IR35-00-2
VPS
Peak package's surface temperature: 215 ˚C, Reflow time: 40 seconds or less
(at 200 ˚C or higher), Number of reflow processes: 2 or less
<Attention>
(1) Wait for the device temperature to come down to room temperature
after the first reflow before starting the second reflow.
(2) Do not perform flux cleaning of the soldered portion after the first reflow.
VP15-00-2
Wave soldering
Solder temperature: 260 ˚C or below, Flow time: 10 seconds or less, Number of flow WS60-00-1
process: 1, Preheating temperature; 120 ˚C max. (package surface temperature)
Partial heating
Pin temperature: 300 ˚C or below, Time: 3 seconds or less (per pin row)
—
Caution Do not use different soldering methods together (except for partial heating).
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