UPD98402A Datasheet, PDF (24/26 Pages) NEC – LOCAL ATM SONET FRAMER

µPD98402A
4. RECOMMENDED SOLDERING CONDITIONS
For the µPD98402A, soldering must be performed under the following conditions.
For details of recommended conditions for surface mounting, refer to information document “Semiconductor
Device Mounting Technology Manual” (IEI-1207).
For other soldering methods, please consult with NEC sales personnel.
• µPD98402AGM-KED: 160-pin plastic QFP (FINE PITCH) (24 × 24 mm)
Soldering Method
Infrared reflow
Pin partial heating
Soldering Conditions
Package peak temperature: 235 °C, time: 30 sec. max. (over 210 °C), count:
twice or less, restriction days: 3^Note (after that, 125 °C pre-baking for 20 hours
is necessary)
Precautions:
(1) Reflow a second time should be started when the device temperature has
returned to its normal state after the first reflow.
(2) Avoid flux cleaning with water after the first reflow.
Pin temperature: 300 °C max., time: 3 seconds max. (per side)
Symbol
IR35-203-2
—
Note This means the number of days after unpacking the dry pack. Storage conditions are 25 °C and 65 % RM
max.
24