GCM31A7U2J102JX01D Datasheet, PDF (36/43 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors for Automotive

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Notice
Continued from the preceding page.
4. Flux Application
1. An excessive amount of flux generates a large quantity of
flux gas, which can cause a deterioration of Solderability.
So apply flux thinly and evenly throughout. (A foaming
system is generally used for flow soldering).
2. Flux containing too a high percentage of halide may
cause corrosion of the outer electrodes unless there is
sufficient cleaning. Use flux with a halide content of 0.1%
max.
Notice (Soldering and Mounting) ₁
3. Do not use strong acidic flux.
4. Do not use water-soluble flux.
(*Water-soluble flux can be defined as non rosin type flux
including wash-type flux and non-wash-type flux.)
5. Flow Soldering
o Set temperature and time to ensure that leaching of the
outer electrode does not exceed 25% of the chip end
area as a single chip (full length of the edge A-B-C-D
shown right) and 25% of the length A-B shown below as
mounted on substrate.
[As a Single Chip]
A
B
D
C
Outer Electrode
[As Mounted on Substrate]
B
A
6. Washing
1. Please evaluate a capacitor by actual cleaning equipment
and condition surely for confirming the quality and select
the applicable solvent.
2. Unsuitable cleaning solvent may leave residual flux, other
foreign substances, causing deterioration of electrical
characteristics and the reliability of the capacitors.
3. Select the proper cleaning conditions.
3-1. Improper cleaning conditions (excessive or
insufficient) may result in the deterioration of the
performance of the capacitors.
7. Coating
1. A crack may be caused in the capacitor due to the stress
of the thermal contraction of the resin during curing
process.
The stress is affected by the amount of resin and curing
contraction.
Select a resin with small curing contraction.
The difference in the thermal expansion coefficient
between a coating resin or a molding resin and capacitor
may cause the destruction and deterioration of the
capacitor such as a crack or peeling, and lead to the
deterioration of insulation resistance or dielectric
breakdown.
Select a resin for which the thermal expansion coefficient
is as close to that of capacitor as possible.
A silicone resin can be used as an under-coating to buffer
against the stress.
2. Select a resin that is less hygroscopic.
Using hygroscopic resins under high humidity conditions
may cause the deterioration of the insulation resistance of
a capacitor.
An epoxy resin can be used as a less hygroscopic resin.
37