GCM31A7U2J102JX01D Datasheet, PDF (27/43 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors for Automotive

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1 ^{!Caution (Soldering and Mounting)}
Continued from the preceding page.
4-1. Reflow Soldering
1. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB board.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and
the components surface (∆T) as small as possible.
2. Solderability of Tin plating termination chips might be
deteriorated when a low temperature soldering profile
where the peak solder temperature is below the melting
point of Tin is used. Please confirm the Solderability of Tin
plated termination chips before use.
3. When components are immersed in solvent after mounting,
be sure to maintain the temperature difference (∆T)
between the component and the solvent within the range
shown in the table 1.
Table 1
Part Number
GRM03/15/18/21/31
GCM32
Temperature Differential
∆TV190°C
∆TV130°C
Recommended Conditions
Pb-Sn Solder
Lead Free Solder
Infrared Reflow Vapor Reflow
Peak Temperature 230 to 250°C 230 to 240°C 240 to 260°C
Atmosphere
Air
Air
Air or N2
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
[Standard Conditions for Reflow Soldering]
Infrared Reflow
Temperature (D)
Peak Temperature

,
,
,
_200°C
∆T
170°C

,
,
,
 150°C
130°C
Preheating
Soldering
Gradual
Cooling

,
,
,
 _Time
60-120 seconds 30-60 seconds
Temperature (D)
Peak Temperature
Vapor Reflow

,
,
,
_∆T
170°C

,
,
,
 150°C
130°C
Preheating
Soldering
Gradual
Cooling

,
,
,
 _Time
60-120 seconds 20 seconds max.
[Allowable Reflow Soldering Temperature and Time]
280
,
,
, 270
260
250
,
,
, ₂₄₀
,
,
, ²³⁰
220
0
30
60
90
120
Soldering Time (sec.)
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
4. Optimum Solder Amount for Reflow Soldering
4-1. Overly thick application of solder paste results in a
excessive solder fillet height.
This makes the chip more susceptible to mechanical
and thermal stress on the board and may cause the
chips to crack.
4-2. Too little solder paste results in a lack of adhesive
strength on the outer electrode, which may result in
chips breaking loose from the PCB.
4-3. Make sure the solder has been applied smoothly to
the end surface to a height of 0.2mm* min.
Inverting the PCB
Make sure not to impose any abnormal mechanical shocks
to the PCB.
28
∗ _{GRM03: 1/3 of Chip Thickness min.}
0.2mm^∗ min.
in section
Continued on the following page.