GCM31A7U2J102JX01D Datasheet, PDF (28/43 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors for Automotive

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!Caution
Continued from the preceding page.
4-2. Flow Soldering
1. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage in the components, preheating
should be required for both of the components and the
PCB board.
Preheating conditions are shown in table 2. It is required
to keep temperature differential between the solder and
the components surface (∆T) as small as possible.
2. Excessively long soldering time or high soldering
temperature can result in leaching of the outer electrodes,
causing poor adhesion or a reduction in capacitance
value due to loss of contact between electrodes and end
termination.
3. When components are immersed in solvent after
mounting, be sure to maintain the temperature difference
(∆T) between the component and solvent within the range
shown in the table 2.
4. Do not apply flow soldering to chips not listed in table 2.
Table 2
Part Number
GCM18/21/31
Temperature Differential
∆TV150°C
Recommended Conditions
Pb-Sn Solder
Preheating Peak Temperature 90 to 110°C
Soldering Peak Temperature 240 to 250°C
Atmosphere
Air
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Lead Free Solder
100 to 120°C
250 to 260°C
N2
!Caution (Soldering and Mounting) ₁
[Standard Conditions for Flow Soldering]
Temperature (D)
Soldering
Soldering

,
,
,
, _Peak
Temperature
Gradual
Cooling
∆T

,
,
,
, _Preheating
Peak
Temperature

,
,
,
, _Preheating
Time
30-90 seconds
5 seconds max.
[Allowable Flow Soldering Temperature and Time]
280
270
260

,
,
, 250
240
230

,
,
, ₂₂₀
0
10
20
30
40
^{Soldering Time (sec.)}
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
5. Optimum Solder Amount for Flow Soldering
5-1. The top of the solder fillet should be lower than the
thickness of components. If the solder amount is
excessive, the risk of cracking is higher during board
bending or any other stressful condition.
Up to Chip Thickness
Adhesive
in section
Continued on the following page.
29