CM300DX-12A Datasheet, PDF (4/7 Pages) Mitsubishi Electric Semiconductor – IGBT MODULES HIGH POWER SWITCHING USE

Chip Location (Top view)
MITSUBISHI IGBT MODULES
CM300DX-12A
HIGH POWER SWITCHING USE
Dimensions in mm (tolerance: ±1mm)
0
18.6
28.2
(152)
(121.7)
(110)
46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25
47
Di2 Tr2
24
Th
Di1
48
Tr1
23
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
0
29.8
40.9
LABEL SIDE
Each mark points the center position of each chip. Tr*: IGBT, Di*: FWDi, Th: NTC thermistor
Jan. 2009
4