MYX29GL01GS11DPIV2 Datasheet, PDF (65/68 Pages) Micross Components – Tin-lead ball metallurgy

Data Sheet
1Gb GL-S MirrorBit^® Eclipse^™
Flash Memory
MYX29GL01GS11DPIV2*
11.2 64-Ball FBGA
11
Physical Interface
11.2.1 Connection Diagram
*Advanced information. Subject to change without notice.
11.1
Connection Diagram
Figure 11.3 64-ball Fortified Ball Grid Array
TOP VIEW
Figure 23: 64-ball Fortified Ball Grid Array - Product Pinout (Top View)
PRODUCT Pinout
A
B
C
D
E
F
G
H
NC for GL128S
NC for GL256S, GL128S
-
NC for GL512S, GL256S, GL128S
8
NC
A22
A23
Vio
VSS
A24
A25
NC
7
A13
A12
A14
A15
A16
RFU
DQ15
VSS
6
A9
A8
A10
A11
DQ7
DQ14 DQ13
DQ6
5
WE#
RESET#
A21
A19
DQ5
DQ12
VCC
DQ4
4
RY/BY# WP#
A18
A20
DQ2
DQ10 DQ11
DQ3
3
A7
A17
A6
A5
DQ0
DQ8
DQ9
DQ1
2
A3
A4
A2
A1
A0
CE#
OE#
VSS
1
NC
NC
NC
NC
DNU
Vio
RFU
NC
No^N₁t_.e^ots_B^e:_a^s_l^:_{l E1, Do Not Use (DNU), a device internal signal is connected to the package connector. The connector may be used by Spansion for}
test or other purposes and is not intended for connection to any host system signal. Do not use these connections for PCB Signal routing
1. Bcahlal nEn1el,s.DThoouNgoh tnoUt sreeco(mDmNeUnd)e,da, thdeebvaicll ecaninbteercnonanlescitgedntaolVis_CCcoor nVn_SSetchrtoeudghtoa stehreiespreascisktoar.ge connector. The
2._cB_oa_nll_ns _eF_c7 _ta_on_rd _mG1_a, _yRe_bse_erv_ue_sd_efo_dr F_bu_ytur_te_hU_es_Oe (_CRF_MU)._{for test or other purposes and is not intended for connection to}
3._aB_na_ylls_hA_o1_s,_tA_s8,_yC_s1_te, D_m1,_sH_i1_g,_na_and_l. H_D8_o, N_no_oC_ton_un_se_ect_t(_hN_eC_s)._{e connections for PCB Signal routing channels. Though not}
recommended, the ball can be connected to V_CC or V_SS through a series resistor.
2. Balls F7 and G1, Reserved for Future Use (RFU).
3. Balls A1, A8, C1, D1, H1, and H8, No Connect (NC).
MYX29GL01GS11DPIV2
Revision 1.0 - 01/26/2015
65
Form #: CSI-D-685 Document 001