APT30M70BVFRG Datasheet, PDF (18/44 Pages) Microsemi Corporation – Power Semiconductors Power Modules RF Power MOSFETs

Packaging
Improved Low Profile Packages
SP1 (12mm)
SP3 (12mm)
SP4 (17mm)
SP6 (17mm)
SP6-P (12mm) _SP1
SP3F
SP3
SP4
Industry Standard Packages
SOT-227 (Isotop^®)
SP2 (17mm)
34mm & 62mm Types
D1 (34 mm Wide)
SOT-227
SP2
D1
D3 (62 mm Wide)
D4 (62 mm Wide)

SP6
D3
SP6-P
D4
SD1
SD2
SM1
SM2
SM2-1
SM3
SM3-1
SM4
SM5
SF1
Mini-Mod
Surface Mount
Mini-Mod
TO-249
9-pin TO-249
Package Advantages
SP6 - SAPTmMoOduDlUe LE
12 mm
ISOTOP ®
Twin Tower
VJ
Half Pack
SP1 package:
-Replaces 2 SOT-227 parts
-Improved assembly time and cost
-Height compatible with SOT-227
-Copper base plate
SP3F package:
-Replaces up to 4 SOT-227 parts
-Reduced assembly time and cost
-Height compatible with SOT-227
-Copper base plate
30 mm
17 mm
SP6 package:
Offers the same footprint and the same
pinout location as the popular 62mm
package but with lower height, leading to:
- Reduced stray inductance
- Reduced parasitic resistance
- Higher efficiency at high frequency
SP6-P package:
-Replaces up to 6 SOT-227 parts
-Height compatible with SOT-227
-Low inductance solder pins
-High current capability
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