English
Language : 

MT48LC16M16A2TG-75ITD Datasheet, PDF (62/86 Pages) Micron Technology – 256Mb: x4, x8, x16 SDRAM
Figure 35: WRITE-to-PRECHARGE
T0
CLK
tWR @ tCK ≥ 15ns
DQM
Command
WRITE
Address
Bank a,
Col n
DQ
DIN
256Mb: x4, x8, x16 SDRAM
WRITE Operation
T1
T2
T3
T4
T5
T6
NOP
PRECHARGE
tRP
NOP
NOP
Bank
(a or all)
tWR
DIN
ACTIVE
Bank a,
Row
NOP
tWR @ tCK < 15ns
DQM
Command
WRITE
NOP
Address
Bank a,
Col n
DQ
DIN
DIN
NOP
PRECHARGE
tRP
NOP
NOP
Bank
(a or all)
t WR
ACTIVE
Bank a,
Row
Transitioning data
Don’t Care
Note: 1. In this example DQM could remain LOW if the WRITE burst is a fixed length of two.
Fixed-length WRITE bursts can be truncated with the BURST TERMINATE command.
When truncating a WRITE burst, the input data applied coincident with the BURST
TERMINATE command is ignored. The last data written (provided that DQM is LOW at
that time) will be the input data applied one clock previous to the BURST TERMINATE
command. This is shown in Figure 36 (page 63), where data n is the last desired data
element of a longer burst.
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. S 12/12 EN
62
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 1999 Micron Technology, Inc. All rights reserved.