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PL130-07 Datasheet, PDF (9/16 Pages) Microchip Technology – High Speed Translator Buffer to LVCMOS | |||
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PL130-07
16-Lead QFN 3 mm x 3 mm Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
ï£ 2016 Microchip Technology Inc.
DS20005598A-page 9
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