|
PL130-07 Datasheet, PDF (7/16 Pages) Microchip Technology – High Speed Translator Buffer to LVCMOS | |||
|
◁ |
PL130-07
3.0 PACKAGING INFORMATION
8 Lead TSSOP Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
ï£ 2016 Microchip Technology Inc.
DS20005598A-page 7
|
▷ |