PL130-07 Datasheet, PDF (4/16 Pages) Microchip Technology – High Speed Translator Buffer to LVCMOS

PL130-07
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Sym. Min. Typ.
Max. Units
Conditions
Temperature Ranges
Storage Temperature Range
Ambient Operating Temperature
Junction Temperature
Lead Temperature
T_S
–65
—
T_A
–40
—
T_J
—
—
—
—
—
+150
+85
+125
+260
°C —
°C Note 2
°C —
°C Soldering, 10 seconds
Note 1:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., T_A, T_J, _JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
2: Operating Temperature is guaranteed by design for all parts (COMMERCIAL and INDUSTRIAL), but
tested for COMMERCIAL grade only.
DS20005598A-page 4
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