PIC16F887I-PT Datasheet, PDF (257/338 Pages) Microchip Technology – 28/40/44-Pin Flash-Based, 8-Bit CMOS Microcontrollers

PIC16F882/883/884/886/887
17.6 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  TA  +125°C
Param
No.
Sym.
Characteristic
Typ. Units
Conditions
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Note 1:
2:
3:
JA
Thermal Resistance
Junction to Ambient
47.2
C/W 40-pin PDIP package
24.4
C/W 44-pin QFN package
45.8
C/W 44-pin TQFP package
60.2
C/W 28-pin PDIP package
80.2
C/W 28-pin SOIC package
89.4
C/W 28-pin SSOP package
29
C/W 28-pin QFN package
JC
Thermal Resistance
Junction to Case
24.7
C/W 40-pin PDIP package
20.0
C/W 44-pin QFN package
14.5
C/W 44-pin TQFP package
29
C/W 28-pin PDIP package
23.8
C/W 28-pin SOIC package
23.9
C/W 28-pin SSOP package
20.0
C/W 28-pin QFN package
TJ
Junction Temperature
150
C For derated power calculations
PD
Power Dissipation
—
W PD = PINTERNAL + PI/O
PINTERNAL Internal Power Dissipation
—
W
PINTERNAL = IDD x VDD
(NOTE 1)
PI/O
I/O Power Dissipation
—
W PI/O =  (IOL * VOL) +  (IOH * (VDD -
VOH))
PDER
Derated Power
—
W PDER = (TJ - TA)/JA
(NOTE 2, 3)
IDD is current to run the chip alone without driving any load on the output pins.
TA = Ambient Temperature.
Maximum allowable power dissipation is the lower value of either the absolute maximum total power
dissipation or derated power (PDER).
 2006-2012 Microchip Technology Inc.
DS41291G-page 257