PIC24HJ64GP506-I Datasheet, PDF (236/292 Pages) Microchip Technology – High-Performance, 16-Bit Microcontrollers

PIC24HJXXXGPX06/X08/X10
24.1 DC Characteristics
TABLE 24-1: OPERATING MIPS VS. VOLTAGE
Characteristic
VDD Range
(in Volts)
Temp Range
(in °C)
3.0-3.6V
-40°C to +85°C
Max MIPS
PIC24HJXXXGPX06/X08/X10
40
TABLE 24-2: THERMAL OPERATING CONDITIONS
Rating
Industrial Temperature Devices
Operating Junction Temperature Range
Operating Ambient Temperature Range
Power Dissipation:
Internal chip power dissipation:
PINT = VDD x (IDD – Σ IOH)
I/O Pin Power Dissipation:
I/O = Σ ({VDD – VOH} x IOH) + Σ (VOL x IOL)
Maximum Allowed Power Dissipation
Symbol Min
Typ
Max Unit
TJ
-40
—
+125
°C
TA
-40
—
+85
°C
PD
PINT + PI/O
W
PDMAX
(TJ – TA)/θJA
W
TABLE 24-3: THERMAL PACKAGING CHARACTERISTICS
Characteristic
Symbol Typ Max Unit Notes
Package Thermal Resistance, 100-pin TQFP (14x14x1 mm)
θJA
40
—
°C/W
1
Package Thermal Resistance, 100-pin TQFP (12x12x1 mm)
θJA
40
—
°C/W
1
Package Thermal Resistance, 64-pin TQFP (10x10x1 mm)
θJA
40
—
°C/W
1
Note 1: Junction to ambient thermal resistance, Theta-JA (θJA) numbers are achieved by package simulations.
DS70175H-page 234
© 2009 Microchip Technology Inc.