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24AA64_02 Datasheet, PDF (21/24 Pages) Microchip Technology – 64K I2C™ Serial EEPROM
24AA64/24LC64
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X
/XX
Device Temperature Package
Range
Device:
24AA64:
24AA64T:
24AA64X
24AA64XT
24LC64:
24LC64T:
24LC64X
24LC64XT
1.8V, 64 Kbit I2C Serial EEPROM
1.8V, 64 Kbit I2C Serial EEPROM
(Tape and Reel)
1.8V, 64 Kbit I2C Serial EEPROM in
alternate pinout (ST only)
1.8V, 64 Kbit I2C Serial EEPROM in
alternate pinout (ST only)
2.5V, 64 Kbit I2C Serial EEPROM
2.5V, 64 Kbit I2C Serial EEPROM
(Tape and Reel)
2.5V, 64 Kbit I2C Serial EEPROM in
alternate pinout (ST only)
2.5V, 64 Kbit I2C Serial EEPROM in
alternate pinout (ST only)
Temperature I = -40°C to +85°C
Range:
E = -40°C to +125°C
Package:
P=
SN =
SM =
ST =
MS =
Plastic DIP (300 mil body), 8-lead
Plastic SOIC (150 mil body), 8-lead
Plastic SOIC (208 mil body), 8-lead
Plastic TSSOP (4.4 mm), 8-lead
Plastic Micro Small Outline (MSOP), 8-lead
Examples:
a) 24AA64-I/P: Industrial Temperature,
PDIP package
b) 24AA64-I/SN: Industrial Temperature,
SOIC package
c) 24AA64-I/SM: Industrial Temperature,
SOIC (208 mil) package
d) 24AA64X-I/ST: Industrial Temperature,
Rotated TSSOP package
e) 24AA64-I/ST: Industrial Temperature,
TSSOP package
a) 24LC64-I/P: Industrial Temperature,
PDIP package
b) 24LC64-E/SN: Extended Temperature,
SOIC package
c) 24LC64-E/SM: Extended Temperature,
SOIC (208 mil) package
d) 24LC64X-I/ST : Extended Temperature,
Rotated TSSOP package
e) 24LC64-I/ST: Industrial Temperature,
TSSOP package
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
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 2002 Microchip Technology Inc.
DS21189F-page 21