24AA64_02 Datasheet, PDF (18/24 Pages) Microchip Technology – 64K I2C™ Serial EEPROM

24AA64/24LC64
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
p
E
E1
B
n
c
D
2
1
A
A1
φ
α
A2
(F)
L
β
Units
INCHES
MILLIMETERS*
Number of Pins
Pitch
Overall Height
Dimension Limits
MIN
n
p
A
NOM
MAX
MIN
8
.026
.044
NOM
0.65
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
A2
.030
.034
.038
0.76
0.86
A1
.002
.006
0.05
E
.184
.193
.200
4.67
4.90
E1
.114
.118
.122
2.90
3.00
Overall Length
Foot Length
D
.114
.118
.122
2.90
3.00
L
.016
.022
.028
0.40
0.55
Footprint (Reference)
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
F
.035
.037
.039
0.90
0.95
φ
0
6
0
c
.004
.006
.008
0.10
0.15
B
.010
.012
.016
0.25
0.30
α
7
7
β
7
7
*Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
MAX
8
1.18
0.97
0.15
.5.08
3.10
3.10
0.70
1.00
6
0.20
0.40
Drawing No. C04-111
DS21189F-page 18
 2002 Microchip Technology Inc.