PIC16F72 Datasheet, PDF (123/136 Pages) Microchip Technology – 28-Pin, 8-Bit CMOS FLASH MCU with A/D Converter

PIC16F72
28-Lead Plastic Quad Flat No Leads Package (ML) 6x6 mm Body (QFN)
E
EXPOSED
METAL
E1
PADS
CH x 45
TOP VIEW
α
D1 D
2
1
n
D2
R
E2
BOTTOM VIEW
Q
p
B
L
A2
A
A1
A3
Units
Dimension Limits
Number of Pins
n
Pitch
p
Overall Height
A
Molded Package Thickness
A2
Standoff
A1
Base Thickness
A3
Overall Width
E
Molded Package Width
E1
Exposed Pad Width
E2
Overall Length
D
Molded Package Length
D1
Exposed Pad Length
D2
Lead Width
B
Lead Length
L
Tie Bar Width
R
Tie Bar Length
Q
Chamfer
CH
Mold Draft Angle Top
α
MIN
.000
.140
.140
.009
.020
.005
.012
.009
INCHES
NOM
28
.026 BSC
.033
.026
.0004
.008 REF.
.236 BSC
.226 BSC
.146
.236 BSC
.226 BSC
.146
.011
.024
.007
.016
.017
MAX
.039
.031
.002
.152
.152
.014
.030
.010
.026
.024
12
MILLIMETERS*
MIN
NOM
28
0.65 BSC
0.85
0.65
0.00
0.01
0.20 REF.
6.00 BSC
5.75 BSC
3.55
3.70
6.00 BSC
5.75 BSC
3.55
3.70
0.23
0.28
0.50
0.60
0.13
0.17
0.30
0.40
0.24
0.42
MAX
1.00
0.80
0.05
3.85
3.85
0.35
0.75
0.23
0.65
0.60
12
* Controlling Parameter
Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC equivalent: pending
Drawing No. C04-114
 2002 Microchip Technology Inc.
DS39597B-page 121