DS5003 Datasheet, PDF (6/24 Pages) Maxim Integrated Products – Secure Microprocessor Chip

Secure Microprocessor Chip
AC CHARACTERISTICS—BYTE-WIDE ADDRESS/DATA BUS TIMING (continued)
(V_CC = 5V ±10%, T_A = 0°C to +70°C.) (Figure 6)
PARAMETER
SYMBOL
MIN
MAX
UNITS
Delay from R/W Low to Valid Data Out During
MOVX (Write)
t_RWLDV
20
ns
Valid Data Out Hold Time from CE1–CE4, PE1–PE4,
or CE1N High
t_CEHDV
1t_CLK - 15
ns
Valid Data Out Hold Time from R/W High
t_RWHDV
0
ns
Write Pulse Width (R/W Low Time)
t_RWLPW
6t_CLK - 20
ns
RPC AC CHARACTERISTICS—DBB READ
(V_CC = 5V ±10%, T_A = 0°C to +70°C.) (Figure 7)
PARAMETER
CS, A0 Setup to RD
CS, A0 Hold After RD
RD Pulse Width
CS, A0 to Data Out Delay
RD to Data Out Delay
RD to Data Float Delay
SYMBOL
MIN
t_AR
0
t_RA
0
t_RR
160
t_AD
t_RD
0
t_RDZ
MAX
130
130
85
UNITS
ns
ns
ns
ns
ns
ns
RPC AC CHARACTERISTICS—DBB WRITE
(V_CC = 5V ±10%, T_A = 0°C to +70°C.) (Figure 7)
PARAMETER
CS, A0 Setup to WR
CS Hold After WR
A0 Hold After WR
WR Pulse Width
Data Setup to WR
Data Hold After WR
SYMBOL
MIN
t_AW
0
t_WA
0
t_WA
20
t_WW
160
t_DW
130
t_WD
20
MAX
AC CHARACTERISTICS—DMA
(V_CC = 5V ±10%, T_A = 0°C to +70°C.)
PARAMETER
DACK to WR or RD
RD or WR to DACK
DACK to Data Valid
RD or WR to DRQ Cleared
SYMBOL
MIN
t_ACC
0
t_CAC
0
t_ACD
0
t_CRQ
MAX
130
110
6 _______________________________________________________________________________________
UNITS
ns
ns
ns
ns
ns
ns
UNITS
ns
ns
ns
ns