MAX8893A Datasheet, PDF (50/50 Pages) Maxim Integrated Products – μPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP

µPMICs for Multimedia Application Processors
in a 3.0mm x 2.5mm WLP
PROCESS: BiCMOS
Chip Information
Package Information
For the latest package outline information and land pat-
terns, go to www.maxim-ic.com/packages. Note that
a “+”, “#”, or “-” in the package code indicates RoHS
status only. Package drawings may show a different suf-
fix character, but the drawing pertains to the package
regardless of RoHS status.
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
30 WLP
W302A3+2
21-0016
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied.
Maxim reserves the right to change the circuitry and specifications without notice at any time.
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