MAX8893A Datasheet, PDF (2/50 Pages) Maxim Integrated Products – μPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP

µPMICs for Multimedia Application Processors
in a 3.0mm x 2.5mm WLP
ABSOLUTE MAXIMUM RATINGS
IN1, IN2, BATT, COM1, COM2 to AGND.............-0.3V to +6.0V
BUCK, LS, ENLS, ENBUCK, ENLDO1, ENLDO2,
ENLDO3, ENLDO45, REFBP, LDO2, LDO3,
SCL, SDA, ENUSB, CB, NC1, NC2,
NO1, NO2 to AGND........................... -0.3V to (VBATT + 0.3V)
LDO1, LDO4, LDO5 to AGND.................. -0.3V to (VIN2 + 0.3V)
PGND to AGND....................................................-0.3V to +0.3V
LX Current...................................................................... 1.5ARMS
LX to AGND (Note 1)................................ -0.3V to (VIN1 + 0.3V)
Continuous Power Dissipation (TA = +70NC)
30-Bump, 3.0mm x 2.5mm WLP (derate 20.0mW/NC
above +70NC).............................................................1600mW
Junction-to-Ambient Thermal Resistance (θJA)
(Note 2).........................................................................50NC/W
Operating Temperature Range........................... -40NC to +85NC
Junction Temperature......................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Bump Temperature (soldering)
Infrared (15s)...............................................................+200NC
Vapor Phase (20s).......................................................+215NC
Note 1: LX has internal clap diodes to PGND and IN1. Applications that forward bias these diodes should take care not to exceed
the IC’s package-dissipation limits.
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(Typical Operating Circuit, VIN = 3.7V, CBATT = CIN1 = CIN2 = 2.2FF, CREFBP = 0.1FF, TA = -40NC to +85NC, unless otherwise noted.
Typical values are at TA = +25NC.) (Notes 3, 4)
PARAMETER
Input Supply Range
Shutdown Supply Current
No-Load Supply Current
Light-Load Supply Current
UNDERVOLTAGE LOCKOUT
Undervoltage Lockout (Note 5)
THERMAL SHUTDOWN
Thermal Shutdown Threshold
Thermal Shutdown Hysteresis
REFERENCE
Reference Bypass Output
Voltage
CONDITIONS
VCB = 0V or VIN, VENUSB = VIN, VENLS = VENBUCK =
VENLDO1 = VENLDO2 = VENLDO3 = VENLDO45 = 0V
No load on BUCK, LDO1, LDO2, LDO3, LDO4, and
LDO5, VENUSB = 0V, VENLS = VIN
BUCK on with 500FA load, all LDOs on with no load,
VENUSB = 0V, VENLS = VIN
VIN_ rising
VIN_ falling
TA rising
MIN TYP MAX UNIT
2.7
5.5
V
0.6
5
FA
160 200
FA
315
FA
2.70 2.85 3.05
V
2.35 2.55
160
NC
10
NC
0.786 0.800 0.814
V
REF Supply Rejection
2.7V P VIN P 5.5V
LOGIC AND CONTROL INPUTS
Input Low Level
ENLS, ENBUCK, ENLDO1, ENLDO2, ENLDO3,
ENLDO45, ENUSB, SDA, SCL, 2.7V P VIN P 5.5V
Input High Level
ENLS, ENBUCK, ENLDO1, ENLDO2, ENLDO3,
ENLDO45, ENUSB, SDA, SCL, 2.7V P VIN P 5.5V
0.2
mV/V
0.4
V
1.4
V
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