MAX14827 Datasheet, PDF (3/41 Pages) Maxim Integrated Products – Integrated LED Driver

MAX14827
IO-Link Device Transceiver
Absolute Maximum Ratings
(All voltages referenced to GND, unless otherwise noted.)
V24..........................................................................-70V to +65V
REG...............................................................-0.3V to (V5 + 16V)
V5, VL.......................................................................-0.3V to +6V
V33...............................................................-0.3V to (V5 + 0.3V)
C/Q, DO, DI................... MIN: Larger of -70V and (V₂₄ - 70V) to
MAX: the lower of +70V and (V₂₄ + 70V)
Logic Inputs:
CS/PP, TXEN, TX, LED1IN, LI,
UARTSEL, CLK/TXEN/200MA, SPI/PIN,
SDI/TX/NPN...............................................-0.3V to (VL + 0.3V)
Logic Outputs:
RX, LI, LO WU, SDO/RX/THSH................. -0.3V to (V_L + 0.3V)
IRQ/OC...................................................................-0.3V to +6V
LED1, LED2................................................... -0.3V to (V5+0.3V)
Continuous Current Into GND and V24.................................±1A
Continuous Current Into C/Q and DO.............................±500mA
Continuous Current Into V5 and REG.............................±100mA
Continuous Current Into Any Other Pin.............................±50mA
Continuous Power Dissipation
TQFN (derate 27.8mW/°C above +70°C)..................2222mW
WLP (derate 22.7mW/°C above +70°C).....................1816mW
Operating Temperature Range.......................... -40°C to +125°C
Maximum Junction Temperature.......................Internally Limited
Storage Temperature Range............................. -65°C to +150°C
Soldering Temperature (reflow, TQFN and WLP)............ +260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics (Note 1)
TQFN
WLP
Junction-to-Ambient Thermal Resistance (θ_JA)...........36°C/W
Junction-to-Case Thermal Resistance (θ_JC)..................3°C/W
Junction-to-Ambient Thermal Resistance (θ_JA)...........44°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
DC Electrical Characteristics
(V₂₄ = 9V to 60V, V5 = 4.5V to 5.5V, VL = 2.5V to 5.5V, V_GND = 0V; REG unconnected, all logic inputs at V_L or GND; T_A = -40°C to
+125°C, unless otherwise noted. Typical values are at V₂₄ = 24V, V5 = 5V, VL = 3.3V, and T_A = +25°C, unless otherwise noted.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
V24 Supply Voltage
V₂₄
9
V24 Undervoltage-Lockout
Threshold
V_24UVLO
V₂₄ rising
V₂₄ falling
6
6
V24 Undervoltage-Lockout-
Threshold Hysteresis
V_{24UVLO_HYST}
C/Q and DO
disabled (CQ_Dis =
1, DO_Dis = 1)
TYP
7.8
7.2
570
0.14
MAX
60
9
9
UNITS
V
V
mV
0.5
V24 Supply Current
C/Q and DO
in push-pull
configuration,
V5 powered
CL[10] = 11, C/Q
I₂₄
externally, REG is and DO high, no
unconnected
load on C/Q or DO
1.1
1.75
mA
C/Q and DO
in push-pull
configuration,
CL[10] = 11, C/Q
and DO low, no load
on C/Q or DO
1.4
1.8
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