MAX14820 Datasheet, PDF (3/29 Pages) Maxim Integrated Products – IO-Link Device Transceiver

MAX14820
IO-Link Device Transceiver
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND, unless otherwise noted.)
V_CC..........................................................................-40V to +40V
V_P (I_VP < 50mA)...... the higher of -0.3V and (V_CC - 1V) to +40V
LDOIN.....................................................................-0.3V to +40V
V₅...................... -0.3V to the lesser of (V_LDOIN + 0.3V) and +6V
LDO33...................... -0.3V to the lesser of (V₅ + 0.3V) and +6V
V_L..............................................................................-0.3V to +6V
DI ............................................................................-40V to +40V
C/Q, DO....................... MIN: the higher of -40V and (V_CC - 40V)
MAX: the lesser of +40V and (V_CC + 40V)
Logic Inputs
TXC, TXQ, TXEN, LO, CS, SDI, SCLK...... -0.3V to (V_L + 0.3V)
Logic Outputs
RX, WU, LI, SDO, IRQ.............................. -0.3V to (V_L + 0.3V)
UV.........................................................................-0.3V to +6V
Continuous Current Into Any Logic Pin............................ Q50mA
Continuous Power Dissipation
TQFN (derate 27.8mW/NC above +70NC)..................2222mW
Operating Temperature Range........................... -40NC to +85NC
Maximum Junction Temperature......................................+150NC
Storage Temperature Range............................. -65NC to +150NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow).......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (B_JA)...........36NC/W
Junction-to-Case Thermal Resistance (B_JC)..................3NC/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
DC ELECTRICAL CHARACTERISTICS
(V_CC = 18V to 36V, V_L = 2.3V to 5.5V, V_GND = 0V; all logic inputs at V_L or GND; T_A = -40NC to +85NC, unless otherwise noted. Typical
values are at V_CC = 24V, V_L = 3.3V, and T_A = +25NC, unless otherwise noted.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
V_CC Supply Voltage
V_CC
For driver operation
9
V_CC Supply Current
V_CC = 24V, C/Q as input, no load on V₅
I_CC
or LDO33, LDOIN not connected to V_P,
V_LDOIN = 24V
V_CC Undervoltage Lockout
Threshold
V_CCUVLO V_CC falling
6
V_CC Undervoltage Lockout
Threshold Hysteresis
V_{CCUVLO_HYST}
V₅ Supply Current
V₅ Undervoltage Lockout
Threshold
I_{5_IN}
V_5UVLO
LDOIN shorted to V₅, external 5V applied
to V₅, no switching, LDO33 disabled
V₅ falling
V_L Logic-Level Supply Voltage
V_L Logic-Level Supply Current
V_L Undervoltage Threshold
5V LDO (V₅)
LDOIN Input Voltage Range
LDOIN Supply Current
V_L
I_L
V_LUVLO
V_LDOIN
I_LDOIN
All logic inputs at V_L or GND
V_L falling
V_LDOIN = 24V, C/Q is configured as an
input, no load on V₅ or LDO33
2.3
0.65
7
TYP
1
7.4
200
3
2.0
0.95
2.5
MAX UNITS
36
V
2.5
mA
9
V
mV
mA
V
5.5
V
5
FA
1.30
V
36
V
5
mA
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