DS8313 Datasheet, PDF (3/18 Pages) Maxim Integrated Products – Smart Card Interface

Smart Card Interface
RECOMMENDED DC OPERATING CONDITIONS (continued)
(V_DD = +3.3V, V_DDA = +5.0V, T_A = +25°C, unless otherwise noted. All specifications apply to both the DS8313 and DS8314, unless
otherwise noted in the CONDITIONS column.) (Note 1)
PARAMETER
CLOCK SOURCE
Crystal Frequency
SYMBOL
CONDITIONS
f_XTAL
f_XTAL1
External crystal (Note 1)
(Note 1)
XTAL1 Operating Conditions
V_{IL_XTAL1} Low-level input on XTAL1
V_{IH_XTAL1} High-level input on XTAL1
External Capacitance for Crystal
C_XTAL1,
C_XTAL2
Internal Oscillator
f_INT
SHUTDOWN TEMPERATURE
Shutdown Temperature
T_SD
RST PIN
Card-Inactive Mode
Output Low Voltage
Output Current
Output Low Voltage
V_{OL_RST1}
I_{OL_RST1}
V_{OL_RST2}
I_{OL_RST} = 1mA
V_{OL_RST} = 0
I_{OL_RST} = 200μA
Output High
Voltage
V_{OH_RST2} I_{OH_RST} = -200μA
Card-Active Mode
CLK PIN
Rise Time
Fall Time
Current Limitation
RSTIN to RST Delay
t_{R_RST}
t_{F_RST}
I_RST(LIMIT)
t_D(RSTIN-RST)
C_L = 30pF (Note 1)
C_L = 30pF (Note 1)
Card-Inactive Mode
Output Low Voltage
Output Current
Output Low Voltage
V_{OL_CLK1}
I_{OL_CLK1}
V_{OL_CLK2}
I_OLCLK = 1mA
V_OLCLK = 0
I_OLCLK = 200μA
Output High
Voltage
V_{OH_CLK2} I_OHCLK = -200μA
Card-Active Mode
VCC PIN
Rise Time
Fall Time
Current Limitation
Clock Frequency
Duty Factor
Slew Rate
t_{R_CLK}
t_{F_CLK}
I_CLK(LIMIT)
f_CLK


SR
C_L = 30pF (Notes 1, 4)
C_L = 30pF (Notes 1, 4)
Operational
C_L = 30pF
C_L = 30pF (Note 1)
Output Low Voltage
Card-Inactive Mode
Output Current
V_CC1
I_CC1
I_CC = 1mA
V_CC = 0
MIN TYP MAX UNITS
0
0
-0.3
0.7 x
V_DD
2.2
20
20
0.3 x
V_DD
V_DD +
0.3
MHz
MHz
V
15
pF
2.7 3.4 MHz
+150
°C
0
0
0
V_CC -
0.5
-20
0.3
V
-1
mA
0.3
V
V_CC
V
0.1
μs
0.1
μs
+20 mA
2
μs
0
0
0
V_CC -
0.5
-70
0
45
0.2
0.3
V
-1
mA
0.3
V
V_CC
V
8
ns
8
ns
+70 mA
10 MHz
55
%
V/ns
0
0.3
V
0
-1
mA
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