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MAX15046_10 Datasheet, PDF (2/24 Pages) Maxim Integrated Products – 40V, High-Performance, Synchronous Buck Controller
40V, High-Performance, Synchronous
Buck Controller
ABSOLUTE MAXIMUM RATINGS
IN to GND..............................................................-0.3V to +45V
VCC to GND..................... -0.3V to lower of (VIN + 0.6V) and 6V
EN, DRV to GND......................................................-0.3V to +6V
PGOOD to GND.....................................................-0.3V to +45V
PGND to GND.......................................................-0.3V to +0.3V
DL to PGND.............................................-0.3V to (VDRV + 0.3V)
BST to PGND ........................................................-0.3V to +50V
LX and CSP to PGND...............................................-1V to +45V
LX and CSP to PGND............................-2V (50ns max) to +45V
BST to LX.................................................................-0.3V to +6V
CSP to LX..............................................................-0.3V to +0.3V
DH to LX................................................... -0.3V to (VBST + 0.3V)
All Other Pins to GND............................... -0.3V to (VCC + 0.3V)
VCC Short Circuit to GND..........................................Continuous
PGOOD Maximum Sink Current.........................................20mA
Continuous Power Dissipation (TA = +70NC):
16-Pin QSOP (derate 9.6mW/NC above +70NC)........771.5mW
16-Pin QSOP-EP (derate 22.7mW/NC above +70NC).1818.2mW
Junction-to-Case Thermal Resistance (θJC) (Note 1)
16-Pin QSOP.................................................................37NC/W
16-Pin QSOP-EP.............................................................6NC/W
Junction-to-Ambient Thermal Resistance (θJA) (Note 1)
16-Pin QSOP............................................................103.7NC/W
16-Pin QSOP-EP...........................................................44NC/W
Operating Temperature Range......................... -40NC to +125NC
Junction Temperature......................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow).......................................+260NC
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-lay-
er board. For detailed information on package thermal considerations, refer to http://www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VIN = 24V, VEN = 5V, VGND = VPGND = 0V, CIN = 1FF, CVCC = 4.7FF, RRT = 49.9kI, TA = TJ = -40NC to +125NC, unless otherwise
noted. Typical values are at TA = +25NC.) (Note 2)
PARAMETER
SYSTEM SPECIFICATIONS
Input-Voltage Range
Quiescent Supply Current
Shutdown Supply Current
VCC REGULATOR
Output Voltage
VCC Regulator Dropout
VCC Short-Circuit Output Current
VCC Undervoltage Lockout
VCC Undervoltage Lockout
Hysteresis
ERROR AMPLIFIER (FB, COMP)
FB Input-Voltage Set Point
FB Input Bias Current
FB to COMP Transconductance
Open-Loop Gain
Unity-Gain Bandwidth
SYMBOL
VIN
IIN_Q
IIN_SBY
VVCC
VCCUVLO
VFB
IFB
gM
CONDITIONS
VIN = VCC = VDRV
VIN = 24V, VFB = 0.9V, no switching
VIN = 24V, VEN = 0V, IVCC = 0,
PGOOD = unconnected
6V ≤ VIN ≤ 40V, ILOAD = 6mA
VIN = 4.5V, ILOAD = 25mA
VIN = 5V
VVCC rising
VFB = 0.6V
ICOMP = Q20FA
Capacitor from COMP to GND =
47pF
MIN
4.5
4.5
5
30
3.8
584
-250
600
TYP MAX
40
5.5
2
3
0.35 0.55
5.25
5.5
0.18 0.45
55
90
4
4.2
400
590
1200
80
5
596
+250
1800
UNITS
V
mA
mA
V
V
mA
V
mV
mV
nA
FS
dB
MHz
2   _______________________________________________________________________________________