MAX1438 Datasheet, PDF (2/22 Pages) Maxim Integrated Products – Octal, 12-Bit, 65Msps, 1.8V ADC with Serial LVDS Outputs Serial LVDS Outputs

Octal, 12-Bit, 65Msps, 1.8V ADC
with Serial LVDS Outputs
ABSOLUTE MAXIMUM RATINGS
(Voltages referenced to GND)
AVDD.....................................................................-0.3V to +2.0V
CVDD.....................................................................-0.3V to +3.6V
OVDD ....................................................................-0.3V to +2.0V
IN_P, IN_N ..............................................-0.3V to (V_AVDD + 0.3V)
CLK ........................................................-0.3V to (V_CVDD + 0.3V)
OUT_P, OUT_N, FRAME_, CLKOUT_ ....-0.3V to (V_OVDD + 0.3V)
DT, SLVS/LVDS, LVDSTEST, PLL_, T/B,
REFIO, REFADJ, CMOUT...................-0.3V to (V_AVDD + 0.3V)
Continuous Power Dissipation (T_A = +70°C)
TQFP (derate 47.6mW/°C above +70°C) ................3809.5mW
Operating Temperature Range ...........................-40°C to +85°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFP
Junction-to-Ambient Thermal Resistance (θ_JA) ...........21°C/W
Junction-to-Case Thermal Resistance (θ_JC) ..................2°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V_AVDD = 1.8V, V_OVDD = 1.8V, V_CVDD = 3.3V, V_GND = 0V, external V_REFIO = 1.24V, C_REFIO = 0.1µF, C_REFP = 10µF, C_REFN = 10µF,
f_CLK = 65MHz (50% duty cycle), V_DT = 0V, T_A = T_MIN to T_MAX, unless otherwise noted. Typical values are at T_A = +25°C.) (Notes 2, 3)
PARAMETER
SYMBOL
CONDITIONS
DC ACCURACY (Note 4)
Resolution
N
Integral Nonlinearity
INL
Differential Nonlinearity
DNL No missing codes over temperature
Offset Error
Gain Error
ANALOG INPUTS (IN_P, IN_N)
Input Differential Range
Common-Mode Voltage Range
V_ID
V_CMO
Differential input
Common-Mode Voltage Range
Tolerance
(Note 5)
Differential Input Impedance
Differential Input Capacitance
CONVERSION RATE
R_IN Switched capacitor load
C_IN
Maximum Conversion Rate
Minimum Conversion Rate
Data Latency
f_SMAX
f_SMIN
DYNAMIC CHARACTERISTICS (differential inputs, 4096-point FFT) (Note 4)
Signal-to-Noise Ratio
Signal-to-Noise and Distortion
(First 4 Harmonics)
SNR
SINAD
f_IN = 5.3MHz at -0.5dBFS
f_IN = 19.3MHz at -0.5dBFS
f_IN = 5.3MHz at -0.5dBFS
f_IN = 19.3MHz at -0.5dBFS
MIN
TYP
MAX UNITS
12
Bits
±0.4
±2.5
LSB
±0.25
±1
LSB
±0.5
%FS
-3.5
+2.0
%FS
1.4
0.76
±50
2
12.5
V_P-P
V
mV
kΩ
pF
65
4.0
6.5
MHz
MHz
Cycles
69.9
dB
66.5
69.6
69.8
dB
66.5
69.6
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