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MAX12557 Datasheet, PDF (2/28 Pages) Maxim Integrated Products – Dual, 65Msps, 14-Bit, IF/Baseband ADC
Dual, 65Msps, 14-Bit, IF/Baseband ADC
ABSOLUTE MAXIMUM RATINGS
VDD to GND ................................................................-0.3V to +3.6V
OVDD to GND............-0.3V to the lower of (VDD + 0.3V) and +3.6V
INAP, INAN to GND ...-0.3V to the lower of (VDD + 0.3V) and +3.6V
INBP, INBN to GND ...-0.3V to the lower of (VDD + 0.3V) and +3.6V
CLKP, CLKN to
GND ........................-0.3V to the lower of (VDD + 0.3V) and +3.6V
REFIN, REFOUT
to GND ..................-0.3V to the lower of (VDD + 0.3V) and +3.6V
REFAP, REFAN,
COMA to GND ......-0.3V to the lower of (VDD + 0.3V) and +3.6V
REFBP, REFBN,
COMB to GND ......-0.3V to the lower of (VDD + 0.3V) and +3.6V
DIFFCLK/SECLK, G/T, PD, SHREF, DIV2,
DIV4 to GND .........-0.3V to the lower of (VDD + 0.3V) and +3.6V
D0A–D13A, D0B–D13B, DAV,
DORA, DORB to GND..............................-0.3V to (OVDD + 0.3V)
Continuous Power Dissipation (TA = +70°C)
68-Pin Thin QFN 10mm x 10mm x 0.8mm
(derate 70mW/°C above +70°C) ....................................4000mW
Operating Temperature Range................................-40°C to +85°C
Junction Temperature ...........................................................+150°C
Storage Temperature Range .................................-65°C to +150°C
Lead Temperature (soldering 10s).......................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VDD = 3.3V, OVDD = 2.0V, GND = 0, REFIN = REFOUT (internal reference), CL ≈ 10pF at digital outputs, VIN = -0.5dBFS (differen-
tial), DIFFCLK/SECLK = OVDD, PD = GND, SHREF = GND, DIV2 = GND, DIV4 = GND, G/T = GND, fCLK = 65MHz, TA = -40°C to
+85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
DC ACCURACY
Resolution
14
Bits
Integral Nonlinearity
INL
fIN = 3MHz
±2.1
LSB
Differential Nonlinearity
DNL
fIN = 3MHz, no missing codes over
temperature (Note 2)
-1.0 ±0.6 +1.3 LSB
Offset Error
±0.1 ±0.9 %FSR
Gain Error
±0.5 ±5.0 %FSR
ANALOG INPUT (INAP, INAN, INBP, INBN)
Differential Input Voltage Range
Common-Mode Input Voltage
Analog Input Resistance
VDIFF Differential or single-ended inputs
RIN
Each input, Figure 3
±1.024
V
VDD / 2
V
3.4
kΩ
Analog Input Capacitance
CPAR
Fixed capacitance to ground,
each input, Figure 3
CSAMPLE
Switched capacitance,
each input, Figure 3
2
pF
4.5
CONVERSION RATE
Maximum Clock Frequency
Minimum Clock Frequency
fCLK
65
MHz
5
MHz
Data Latency
Figure 5
8
Clock
Cycles
DYNAMIC CHARACTERISTICS (differential inputs)
Small-Signal Noise Floor
SSNF Input at -35dBFS
74.5
76
dBFS
Signal-to-Noise Ratio
SNR
fIN = 3MHz at -0.5dBFS
fIN = 32.5MHz at -0.5dBFS
fIN = 70MHz at -0.5dBFS
fIN = 175MHz at -0.5dBFS
72.5
75
74.5
dB
74.1
70.4 72.5
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