5-1437567-8 Datasheet, PDF (287/326 Pages) Tyco Electronics – DIP Switch Part Number Index

Index/Matrixes
Soldering Process Recommendation Guide
The majority of customers utilizing miniature or sub-
miniature switches in the industry today have a great concern
about the switches' capabilities during their soldering and
cleaning cycles. This concern centers around the introduction
of contaminates into the switch contact area which could
cause the switch to experience various failure modes either
immediately or during the life of the switch.
These failure modes can show in a number of manners.
The following are just a few examples: high contact
resistance, open contacts, low dielectric strength, and high
actuation forces causing use-related malfunctions. Since
most fluxes become active with the introduction of high
temperatures used in all soldering techniques, the switch
must either prevent these fluxes from entering into its contact
area or allow cleaning techniques to carry flux particles out.
It must be understood that switch contamination can occur
during any procedure: from hand soldering to Surface Mount
systems for solder reflow.
We at Alcoswitch offer a wide range of switches to handle
any soldering operations. However, certain soldering
conditions will not apply to all switches. The following
conditions and charts should help assist you in the soldering
of our switches in your application. If you need additional
information, please contact the factory.
SOLDERING TYPES
A. WAVE SOLDERING
Top & Bottom board preheat: 200°F (93°C) for approximately 3 to 4 minutes.
Solder Temperature & Dwell Time: 500°F (260°C) for approximately 3 to 5 seconds.
B. HAND SOLDERING
1. 500°F-600°F (260°C-316°C) Utilizing a controlled 40 watt iron for 3 to 5 seconds maximum.
2. 500°F (260°C) Utilizing a controlled 30 watt iron for 10 seconds maximum.
C. DIP SOLDERING
1. Solder Temperature & Dwell Time: 500°F (260°C) for 3-5 seconds maximum.
2. Mounted on PCB .060" thick - Solder Temperature & Dwell Time: 500°F (260°C) for 10 seconds maximum.
D. SURFACE MOUNT
Tyco Electronics performs testing of their Surface Mount switches in accordance with EIA-364-56, Resistance to
Soldering Heat, test procedures 4 (Vapor Phase) and Procedure 5 (Infrared).
CLEANING TYPES
A. Solvent Wash (1.1.1 Trichlorethylene, T.M.S., T.M.C.)
B. Vapor Degreasing
C. Solvent Immersion
D. Aqueous Cleaning
M
M2
Catalog 1308390
Issued 9-04
www.tycoelectronics.com
Dimensions are in inches
Dimensions are shown for
and millimeters unless otherwise reference purposes only.
specified. Values in parentheses Specifications subject
or brackets are metric equivalents. to change.
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