M02016 Datasheet, PDF (9/20 Pages) M/A-COM Technology Solutions, Inc. – CMOS Transimpedance Amplifier with AGC for Fiber Optic Networks up to 1.25 Gbps

M02016
CMOS Transimpedance Amplifier with AGC
for Fiber Optic Networks up to 1.25 Gbps
Rev V4
2.0 Pin/Pad Definitions
2.1
Pin/Pad Definitions
Table 2-1. Pin/Pad Definitions
Die Pad No
Name
Function
1
AGC
Monitor or force AGC voltage
2
V_CC
Power pin. Connect to most positive supply
3
PINK
Common PIN input. Connect to photo diode cathode and a 470 pF capacitor to Gnd ⁽¹⁾
4
PINA
Active PIN input. Connect to photo diode anode
5
V_CC
Power pin. Connect to most positive supply (only one V_CC pad needs to be connected)
6
MON
Analog current sink output. Current matched to average photodiode current. Intended for photo-alignment use only.
7
DOUT
Differential data output (goes low as light increases)
8
DOUTGND Ground return for DOUT pad ⁽²⁾
9
GND
Ground pin. Connect to the most negative supply ⁽²⁾
10
GND
Ground pin. Connect to the most negative supply ⁽²⁾
11
DOUTGND Ground return for DOUT pad ⁽²⁾
12
DOUT
Differential data output (goes high as light increases)
NA
Backside
Backside. Connect to the lowest potential, usually ground
NOTES:
1. Alternatively the photodiode cathode may be connected to a decoupled positive supply, e.g. V_CC.
2. All ground pads are common on the die. Only one ground pad needs to be connected to the TO-Can ground. However, connecting more than one ground
pad to the TO-Can ground, particularly those across the die from each other can improve performance in noisy environments.
9
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