DS60 Datasheet, PDF (9/26 Pages) Dallas Semiconductor – Micro-Centigrade Temperature Sensor

Mechanical Dimensions—SMT 4 Lead Gullwing Form
Figure 1. 4 lead Gullwing Package Outline Drawing.
Notes for Figure 1:
1. The anode side of the device is denoted by the chamfer on the part body. Electrical insulation between the case and the
board is required—slug of the device is not electrically neutral. Do not electrically connect either the anode or cathode to
the slug.
2. Do not handle the device by the lens except as described in Philips Lumileds document AB29.
3. Drawings not to scale.
4. All dimensions are in millimeters.
5. All dimensions without tolerances are for reference only.
6. Recommended solder paste thickness of 0.15mm.
LUXEON K2 with TFFC Datasheet DS60 (10/07)
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