DS60 Datasheet, PDF (10/26 Pages) Dallas Semiconductor – Micro-Centigrade Temperature Sensor

Solder Pad Design—SMT Lead Form
Conductive Pad
Conductive
Pad
Conductive
Pad
Soldermask
Package
Outline
Figure 2. 4 Lead Gullwing Solder Pad Design.
Notes for Figure 2:
1. Electrical isolation is required between signal leads and hexagonal heat slug contact.
2. For optimal thermal performance, maximize board metallization at hexagonal heat slug contact.
Solder Pad Layout—SMT Lead Form
Figure 3. 4 Lead Gullwing Package Solder Pad Layout.
Pin Out Diagram
Figure 4. 4 Lead Gullwing Pin Out Diagram.
LUXEON K2 with TFFC Datasheet DS60 (10/07)
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