DS60 Datasheet, PDF (12/26 Pages) Dallas Semiconductor – Micro-Centigrade Temperature Sensor

Solder Pad Design—2 Lead Gullwing
Figure 6. 2 Lead Gullwing Package Solder Pad Layout.
Notes for Figure 6:
1. Electrical isolation is required between signal leads and hexagonal heat slug contact.
2. For optimal thermal performance, maximize board metallization at hexagonal heat slug contact.
Solder Pad Layout—2 Lead Gullwing
Figure 7. Solder Pad Layout 2 Lead Gullwing.
Pin Out Diagram—Gullwing Form
PIN FUNCTION
1
NC (TRIMMED)
2
ANODE
3
NC (TRIMMED)
4
CATHODE
LUXEON K2 with TFFC Datasheet DS60 (10/07)
Figure 8. 2 Lead Gullwing Pin Out Diagram.
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