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| DS60 Datasheet, PDF (8/26 Pages) Dallas Semiconductor – Micro-Centigrade Temperature Sensor | |||
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Level
2a
JEDEC Moisture Sensitivity
Floor Life
Time
4
weeks
Conditions
⤠30°C /
60% RH
Table 7.
Soak Requirements
Standard
Time
Conditions
(hours)
696 [1]
+ 5/ 0
30°C /
60% RH
Accelerated Environment
Time
Conditions
(hours)
120
+1/ 0
60°C /
60% RH
Note for Table 7:
1. The standard soak time includes a default value of 24 hours for semiconductor manufacturer's exposure time (MET)
between bake and bag and includes the maximum time allowed out of the bag at the distributor's facility.
Reflow Soldering Characteristics[1]
Profile Feature
Average Ramp Up Rate (Tsmax to Tp)
Preheat Temperature Min (Tsmin)
Preheat Temperature Max (Tsmax)
Preheat Time (tsmin to tsmax)
Temperature (TL)
Time Maintained Above Temperature (TL)
Peak / Classification Temperature (TP)
Time Within 5°C of Actual Peak Temperature (TP)
Ramp Down Rate
Time 25°C to Peak Temperature
Table 8.
Lead Free Assembly
3°C / second max
150°C
200°C
60 180 seconds
217°C
60 150 seconds
260°C
20 40 seconds
6°C / second max
8 minutes max
Notes for Table 8:
1. All temperatures refer to topside of the package, measured on the package body surface.
LUXEON K2 with TFFC Datasheet DS60 (10/07)
8
JEDEC 020c
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