LTC3859_15 Datasheet, PDF (40/42 Pages) Linear Technology – Low IQ, Triple Output, Buck/Buck/Boost Synchronous Controller

LTC3859
PACKAGE DESCRIPTION
UHF Package
38-Lead Plastic QFN (5mm ¥ 7mm)
(Reference LTC DWG # 05-08-1701 Rev C)
0.70 p 0.05
5.50 p 0.05
4.10 p 0.05
3.00 REF
5.15 ± 0.05
3.15 ± 0.05
0.25 p 0.05
0.50 BSC
5.5 REF
6.10 p 0.05
7.50 p 0.05
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
5.00 p 0.10
PIN 1
TOP MARK
(SEE NOTE 6)
0.75 p 0.05
0.00 – 0.05
PACKAGE
OUTLINE
3.00 REF
37 38
PIN 1 NOTCH
R = 0.30 TYP OR
0.35 s 45o CHAMFER
0.40 p0.10
1
2
7.00 p 0.10
5.50 REF
5.15 ± 0.10
3.15 ± 0.10
0.200 REF 0.25 p 0.05
0.50 BSC
R = 0.125
TYP
BOTTOM VIEW—EXPOSED PAD
(UH) QFN REF C 1107
R = 0.10
TYP
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE
OUTLINE M0-220 VARIATION WHKD
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
40
3859fa