LTC3118_15 Datasheet, PDF (37/38 Pages) Linear Technology – 18V, 2A Buck-Boost DC/DC Converter with Low-Loss Dual Input PowerPath

Package Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
FE Package
28-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663 Rev K)
Exposed Pad Variation EB
LTC3118
4.75
(.187)
9.60 – 9.80*
(.378 – .386)
4.75
(.187)
28 27 26 2524 23 22 21 20 1918 17 16 15
6.60 ±0.10
2.74
(.108)
4.50 ±0.10
SEE NOTE 4
0.45 ±0.05
EXPOSED
PAD HEAT SINK
ON BOTTOM OF
PACKAGE
1.05 ±0.10
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
4.30 – 4.50*
(.169 – .177)
0.25
REF
0° – 8°
2.74
(.108)
6.40
(.252)
BSC
1 2 3 4 5 6 7 8 9 10 11 12 13 14
1.20
(.047)
MAX
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN _MILLIMETERS
(INCHES)
3. DRAWING NOT TO SCALE
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
0.05 – 0.15
(.002 – .006)
FE28 (EB) TSSOP REV K 0913
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconFnoercmtioonroef iitnsfcoirrcmuiatstiaosndewswcrwib.eldinheearer.icnowmill/nLoTtCin3f1ri1ng8e on existing patent rights.
3118f
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