LTC3114-1_15 Datasheet, PDF (32/34 Pages) Linear Technology – 40V, 1A Synchronous Buck-Boost DC/DC Converter with Programmable Output Current

LTC3114-1
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
FE Package
16-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663 Rev J)
Exposed Pad Variation BB
4.70
(.185)
3.58
(.141)
NOTE 5
6.60 ±0.10
4.50 ±0.10
SEE NOTE 4
2.94 3.05
(.116) (.120)
1.05 ±0.10
0.65 BSC 0.45 ±0.05
RECOMMENDED SOLDER PAD LAYOUT
4.30 – 4.50*
(.169 – .177)
0.25
REF
0° – 8°
NOTE 5
4.90 – 5.10*
(.193 – .201)
3.58
(.141)
16 1514 13 12 1110 9
DETAIL A
2.94 ^6.40
(.116) ^(.252)
BSC
DETAIL A
0.56
(.022)
REF
0.53
(.021)
REF
DETAIL A IS THE PART OF THE
LEAD FRAME FEATURE FOR
REFERENCE ONLY
NO MEASUREMENT PURPOSE
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1.10
(.0433)
MAX
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2.
DIMENSIONS
ARE
IN
MILLIMETERS
(INCHES)
3. DRAWING NOT TO SCALE
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
0.05 – 0.15
(.002 – .006)
FE16 (BB) TSSOP REV J 1012
5. BOTTOM EXPOSED PADDLE MAY HAVE METAL PROTRUSION
IN THIS AREA. THIS REGION MUST BE FREE OF ANY EXPOSED
TRACES OR VIAS ON PBC LAYOUT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
32
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31141fa