LT1010_06 Datasheet, PDF (3/20 Pages) Linear Technology – Fast ±150mA Power Buffer

LT1010
ELECTRICAL CHARACTERISTICS _{The ● indicates specifications which apply over the full operating}
temperature range, otherwise specifications are at T_A = 25°C. (See Note 4. Typical values in curves.)
SYMBOL PARAMETER
V_SOS+
Positive Saturation Offset
V_SOS–
Negative Saturation Offset
R_SAT
Saturation Resistance
CONDITIONS (Note 4)
I_OUT = 0 (Note 5)
I_OUT = 0 (Note 5)
I_OUT = ±150mA (Note 5)
MIN TYP MAX
1.0
●
1.1
0.2
●
0.3
22
●
28
V_BIAS
I_S
Bias Terminal Voltage
Supply Current
R_BIAS = 20Ω (Note 6)
I_OUT = 0, I_BIAS = 0
700
840
● 560
880
9
●
10
UNITS
V
V
V
V
Ω
Ω
mV
mV
mA
mA
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: For case temperatures above 25°C, dissipation must be derated
based on a thermal resistance of 25°C/W for the T package, 130°C/W for
the N8 package and 40°C/W for the DD package for ambient temperatures
above 25°C. See Applications Information.
Note 3: In current limit or thermal limit, input current increases sharply
with input-output differentials greater than 8V; so input current must be
limited. Input current also rises rapidly for input voltages 8V above V ⁺ or
0.5V below V ^–.
Note 4: Specifications apply for 4.5V ≤ V_S ≤ 40V,
V ^– + 0.5V ≤ V_IN ≤ V⁺ – 1.5V and I_OUT = 0, unless otherwise stated.
Temperature range is 0°C ≤ T_J ≤ 100°C, T_C ≤ 100°C.
Note 5: The output saturation characteristics are measured with 100mV
output clipping. See Applications Information for determining available
output swing and input drive requirements for a given load.
Note 6: The output stage quiescent current can be increased by
connecting a resistor between the BIAS pin and V⁺. The increase is
equal to the bias terminal voltage divided by this resistance.
Note 7: Thermal resistance varies depending upon the amount of PC board
metal attached to the pin (Pin 9) of the device. θ_JA is specified for a certain
amount of 1oz copper metal trace connecting to Pin 9 as described in the
thermal resistance tables in the Applications Information section.
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