LTC3536_15 Datasheet, PDF (26/28 Pages) Linear Technology – 1A Low Noise, Buck-Boost DC/DC Converter

LTC3536
Package Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699 Rev C)
0.70 ±0.05
R = 0.125
TYP
6
0.40 ± 0.10
10
3.55 ±0.05
1.65 ±0.05
2.15 ±0.05 (2 SIDES)
PIN 1
PACKAGE TOP MARK
OUTLINE (SEE NOTE 6)
0.25 ± 0.05
0.50
BSC
2.38 ±0.05
(2 SIDES)
0.200 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
3.00 ±0.10 1.65 ± 0.10
(4 SIDES) (2 SIDES)
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45°
CHAMFER
0.75 ±0.05
(DD) DFN REV C 0310
5
1
0.25 ± 0.05
0.50 BSC
0.00 – 0.05
2.38 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
26
MSE Package
12-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1666 Rev D)
BOTTOM VIEW OF
EXPOSED PAD OPTION
2.845 ± 0.102
(.112 ± .004)
0.889 ± 0.127
2.845 ± 0.102
(.112 ± .004)
(.035 ± .005)
1
6
0.35
REF
5.23
(.206)
MIN
1.651 ± 0.102 3.20 – 3.45
(.065 ± .004) (.126 – .136)
0.42 ± 0.038
(.0165 ± .0015)
TYP
0.65
(.0256)
BSC
RECOMMENDED SOLDER PAD LAYOUT
1.651 ± 0.102
(.065 ± .004)
0.12 REF
DETAIL “B”
CORNER TAIL IS PART OF
DETAIL “B” THE LEADFRAME FEATURE.
12
7
4.039 ± 0.102
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
(.159 ± .004)
(NOTE 3)
0.406 ± 0.076
12 11 10 9 8 7
(.016 ± .003)
REF
0.254
(.010)
GAUGE PLANE
DETAIL “A”
0° – 6° TYP
4.90 ± 0.152
(.193 ± .006)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
0.18
(.007)
0.53 ± 0.152
(.021 ± .006)
DETAIL “A”
1.10
(.043)
MAX
1 23 456
0.86
(.034)
REF
SEATING
PLANE _{0.22 – 0.38}
0.1016 ± 0.0508
NOTE:
(.009 – .015)
TYP
0.650
(.0256)
(.004 ± .002)
MSOP (MSE12) 0910 REV D
1. DIMENSIONS IN MILLIMETER/(INCH)
BSC
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
3536fa