LTC3646-1_15 Datasheet, PDF (25/28 Pages) Linear Technology – 40V, 1A Synchronous Step-Down Converter

LTC3646/LTC3646-1
PACKAGE DESCRIPTION
D^DE^EP^Pa^ac^ck^ka^ag^ge
14¹-⁴L^-Le^ea^ad^dP^Pla^las^sti^tc^icD^DF^FN^N (⁽4⁴mm ×^{× 3}3^mm^mm⁾)
(R⁽e^Rf^ee^fr^ee^rn^ecⁿe^ceL^LT^TC^CD^DW^WG^G #^# 0⁰5⁵-^-0⁰8^8--¹1⁷7⁰0⁸8^RR^ee^vv^BB⁾)
0.70 ±0.05
3.60 ±0.05
2.20 ±0.05
3.30 ±0.05
1.70 ±0.05
PACKAGE
OUTLINE
3.00 REF
0.25 ±0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
4.00 ±0.10
(2 SIDES)
8
R = 0.05
TYP
R = 0.115
TYP
0.40 ±0.10
14
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
3.00 ±0.10
(2 SIDES)
0.75 ±0.05
0.00 – 0.05
3.30 ±0.10
1.70 ±0.10
7
3.00 REF
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45°
CHAMFER
(DE14) DFN 0806 REV B
1
0.25 ±0.05
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WGED-3) IN JEDEC
PACKAGE OUTLINE MO-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
For more information www.linear.com/LTC3646
36461fb
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