LTC3822-1 Datasheet, PDF (23/24 Pages) Linear Technology – No RSENSE, Low Input Voltage, Synchronous Step-Down DC/DC Controller

LTC3822-1
PACKAGE DESCRIPTION
DD Package
12-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1725 Rev A)
0.70 ±0.05
R = 0.115
TYP
7
0.40 ± 0.10
12
3.50 ±0.05
2.10 ±0.05
2.38 ±0.05
1.65 ±0.05
PIN 1
PACKAGE TOP MARK
OUTLINE (SEE NOTE 6)
0.25 ± 0.05
0.45 BSC
2.25 REF
0.200 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD AND TIE BARS SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
3.00 ±0.10
(4 SIDES)
0.75 ±0.05
0.00 – 0.05
2.38 ±0.10
1.65 ± 0.10
PIN 1 NOTCH
R = 0.20 OR
0.25 × 45°
CHAMFER
6
1
0.23 ± 0.05
0.45 BSC
2.25 REF
(DD12) DFN 0106 REV A
BOTTOM VIEW—EXPOSED PAD
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
.254 MIN
.045 ±.005
.150 – .165
.189 – .196*
(4.801 – 4.978)
16 15 14 13 12 11 10 9
.009
(0.229)
REF
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
.0165 ± .0015
.0250 BSC
RECOMMENDED SOLDER PAD LAYOUT
.007 – .0098
(0.178 – 0.249)
.015 ± .004 _{× 45°}
(0.38 ± 0.10)
0° – 8° TYP
1 234 5678
.0532 – .0688
(1.35 – 1.75)
.004 – .0098
(0.102 – 0.249)
.016 – .050
(0.406 – 1.270)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2.
DIMENSIONS
ARE
IN
INCHES
(MILLIMETERS)
3. DRAWING NOT TO SCALE
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
.008 – .012
(0.203 – 0.305)
TYP
.0250
(0.635)
BSC
GN16 (SSOP) 0204
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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