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LTC3617_15 Datasheet, PDF (18/20 Pages) Linear Technology – 6A Monolithic Synchronous Step-Down Regulator for DDR Termination
LTC3617
Typical Applications
0.75V, ±6A DDR Termination Using a 1MHz External Clock
VIN
2.5V TO 5.5V
CIN
22µF
×4
RC
6k
CC
1.5nF
VDDQ
1.5V
PGOOD
CC1
10pF
R2
100k
RF
24Ω
CF
1µF
R1
365k
SVIN
RUN
VDDQIN
RT
PVIN
VTTR
LTC3617
SW
PGOOD
ITH
SYNC
SGND
PGND
VFB
1MHz CLOCK
L1: VISHAY IHLP-2525CZ-01 330nH
L1
0.33µH
3617 TA03a
VREF
0.75V
CO1 ±10mA
0.1µF
VTT
0.75V
CO2 ±6A
100µF
External Start-Up
Output Tracking Up/Down
500mV/DIV
VDDQ
VREF/VTT
2ms/DIV
3617 TA03b
500mV/DIV
VDDQ
VREF/VTT
4ms/DIV
3617 TA03c
Package Description
UDD Package
24-Lead Plastic QFN (3mm × 5mm)
(Reference LTC DWG # 05-08-1833 Rev Ø)
3.50 ± 0.05
2.10 ± 0.05
1.50 REF
3.65 ± 0.05
1.65 ± 0.05
0.70 ±0.05
3.00 ± 0.10
PIN 1
TOP MARK
(NOTE 6)
0.75 ± 0.05
R = 0.05 TYP
1.50 REF
23 24
PIN 1 NOTCH
R = 0.20 OR 0.25
× 45° CHAMFER
0.40 ± 0.10
1
2
5.00 ± 0.10
0.25 ±0.05
0.50 BSC
3.50 REF
PACKAGE OUTLINE
4.10 ± 0.05
5.50 ± 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
3.50 REF
3.65 ± 0.10
1.65 ± 0.10
0.200 REF
0.00 – 0.05
(UDD24) QFN 0808 REV Ø
R = 0.115
TYP
0.25 ± 0.05
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
3617fa
18