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LTC3831_15 Datasheet, PDF (1/20 Pages) Linear Technology – High Power Synchronous Switching Regulator Controller for DDR Memory Termination
LTC3831
FEATURES
High Power Synchronous
Switching Regulator Controller
for DDR Memory Termination
DESCRIPTION
n High Power Switching Regulator Controller
for DDR Memory Termination
n VOUT Tracks 1/2 of VIN or External VREF
n No Current Sense Resistor Required
n Low Input Supply Voltage Range: 3V to 8V
n Maximum Duty Cycle > 91% Over Temperature
n Drives All N-Channel External MOSFETs
n High Efficiency: Over 95% Possible
n Programmable Fixed Frequency Operation:
100kHz to 500kHz
n External Clock Synchronization Operation
n Programmable Soft-Start
n Low Shutdown Current: <10μA
n Overtemperature Protection
n Available in 16-Pin Narrow SSOP Package
APPLICATIONS
n DDR SDRAM Termination
n SSTL_2 Interface
n SSTL_3 Interface
The LTC®3831 is a high power, high efficiency switching
regulator controller designed for DDR memory termina-
tion. The LTC3831 generates an output voltage equal
to 1/2 of an external supply or reference voltage. The
LTC3831 uses a synchronous switching architecture
with N-channel MOSFETs. Additionally, the chip senses
output current through the drain-source resistance of the
upper N-channel FET, providing an adjustable current limit
without a current sense resistor.
The LTC3831 operates with input supply voltage as low as
3V and with a maximum duty cycle of > 91%. It includes
a fixed frequency PWM oscillator for low output ripple
operation. The 200kHz free-running clock frequency can
be externally adjusted or synchronized with an external
signal from 100kHz to above 500kHz. In shutdown mode,
the LTC3831 supply current drops to <10μA.
L, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
TYPICAL APPLICATION
VDDQ
5V
2.5V
MBR0530T1
1μF
PVCC2 PVCC1
0.1μF
10k
Q1
MBRS340T3
+ CIN
330μF
×2
VCC
TG
0.1μF
SS
IMAX
+
4.7μF
0.01μF
130k
LTC3831 IFB
FREQSET
BG
SHDN
SHDN
PGND
COMP
GND
C1
33pF
RC
15k
R+
CC
1500pF
R–
FB
0.1μF
1k
LO
1.2μH
Q2
MBRS340T3
+
CIN: SANYO POSCAP 6TPB330M
COUT: SANYO POSCAP 4TPB470M
Q1, Q2: SILICONIX Si4410DY
COUT
470μF
×3
VTT
1.25V
±6A
3831 F01
Figure 1. Typical DDR Memory Termination Application
Efficiency vs Load Current
100
90
80
70
60
50
40
30
20 TA = 25°C
VIN = 2.5V
10 VOUT = 1.25V
0
0
1
2
3
4
5
6
LOAD CURRENT (A)
2831 G01
3831fb
1