PDT006A0X3-SRZ Datasheet, PDF (38/39 Pages) Lineage Power Corporation – 6A Digital Pico DLynxTM: Non-Isolated DC-DC Power Modules 3Vdc ––14.4Vdc input; 0.45Vdc to 5.5Vdc output; 6A Output Current

Preliminary Data Sheet
October 17, 2011
6A Digital Pico DLynx^TM: Non-isolated DC-DC Power Modules
3 –– 14.4Vdc input; 0.45Vdc to 5.5Vdc output; 6A output current
Surface Mount Information
Pick and Place
The 6A Digital Pico DLynx^TM modules use an open
frame construction and are designed for a fully
automated assembly process. The modules are fitted
with a label designed to provide a large surface area
for pick and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300^oC. The label also carries
product information such as product code, serial
number and the location of manufacture.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended inside nozzle diameter
for reliable operation is 3mm. The maximum nozzle
outer diameter, which will safely fit within the allowable
component spacing, is 7 mm.
Bottom Side / First Side Assembly
This module is not recommended for assembly on the
bottom side of a customer board. If such an assembly
is attempted, components may fall off the module
during the second reflow process.
Lead Free Soldering
The 12VDigital Pico DLynx^TM 6A modules are lead-free
(Pb-free) and RoHS compliant and are both forward
and backward compatible in a Pb-free and a SnPb
soldering process. Failure to observe the instructions
below may result in the failure of or cause damage to
the modules and can adversely affect long-term
reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 5-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using Sn/Ag/Cu
solder is shown in Fig. 51. Soldering outside of the
recommended profile requires testing to verify results
and performance.
It is recommended that the pad layout include a test
pad where the output pin is in the ground plane.
The thermocouple should be attached to this test
pad since this will be the coolest solder joints. The
temperature of this point should be:
Maximum peak temperature is 260 C.
Minimum temperature is 235 C.
Dwell time above 217 C: 60 seconds minimum
Dwell time above 235 C: 5 to 15 second
MSL Rating
The 6A Digital Pico DLynx^TM modules have a MSL
rating of 2.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. B (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages should
not be broken until time of use. Once the original
package is broken, the floor life of the product at
conditions of ≤ 30°C and 60% relative humidity varies
according to the MSL rating (see J-STD-033A). The
shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Figure 51. Recommended linear reflow profile
using Sn/Ag/Cu solder.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the testability
of the finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to Board Mounted Power Modules: Soldering and
Cleaning Application Note (AN04-001).
LINEAGE POWER
38