C0603C104J3RECAUTO Datasheet, PDF (9/18 Pages) Kemet Corporation – Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Table 5 – Performance & Reliability: Test Methods and Conditions
Stress
Terminal Strength
Board Flex
Reference
JIS–C–6429
JIS–C–6429
Solderability
J–STD–002
Temperature Cycling JESD22 Method JA–104
Biased Humidity
MIL–STD–202 Method
103
Moisture Resistance
Thermal Shock
MIL–STD–202 Method
106
MIL–STD–202 Method
107
High Temperature Life
Storage Life
MIL–STD–202 Method
108/EIA–198
MIL–STD–202 Method
108
Vibration
MIL–STD–202 Method
204
Mechanical Shock
Resistance to Solvents
MIL–STD–202 Method
213
MIL–STD–202 Method
215
Test or Inspection Method
Appendix 1, Note:Force of 1.8 kg for 60 seconds.
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for
C0G. Flexible termination system – 3.0 mm (minimum).
Magnification 50 X. Conditions:
a) Method B, 4 hours at 155°C, dry heat at 235°C
b) Method B at 215°C category 3
c) Method D, category 3 at 260°C
1,000 Cycles (−55°C to +125°C). Measurement at 24 hours +/− 4 hours after test conclusion.
Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor.
Measurement at 24 hours +/− 4 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours +/− 4 hours after test conclusion.
t = 24 hours/cycle. Steps 7a and 7b not required.
Measurement at 24 hours +/− 4 hours after test conclusion.
−55°C/+125°C. Note: Number of cycles required – 300. Maximum transfer time – 20
seconds.
Dwell time – 15 minutes. Air – Air.
1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied.
150°C, 0 VDC for 1,000 hours.
5 g's for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick
7 secure points on one long side and 2 secure points at corners of opposite sides. Parts
mounted within 2" from any secure point. Test from 10 – 2,000 Hz
Figure 1 of Method 213, Condition F.
Add aqueous wash chemical, OKEM Clean or equivalent.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum
storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on
the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock
should be used promptly, preferably within 1.5 years of receipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1091_C0G_ESD • 12/5/2016 9