C0603C104J3RECAUTO Datasheet, PDF (3/18 Pages) Kemet Corporation – Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Packaging C-Spec Ordering Options Table
Packaging Type
Packaging/Grade
Ordering Code (C-Spec)
Commercial Grade¹
Bulk Bag
7" Reel/Unmarked
13" Reel/Unmarked
7" Reel/Unmarked/2mm pitch²
13" Reel/Unmarked/2mm pitch²
Not required (Blank)
TU
7411 (EIA 0603 and smaller case sizes)
7210 (EIA 0805 and larger case sizes)
7081
7082
Automotive Grade³
7" Reel
13" Reel / Unmarked
7" Reel/Unmarked/2mm pitch²
AUTO
AUTO7411 (EIA 0603 and smaller case sizes)
AUTO7210 (EIA 0805 and larger case sizes)
3190
13" Reel/Unmarked/2mm pitch²
3191
1 _{Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging.}
1 _{The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain}
capacitors that have not been laser marked. The option to laser mark is not available on these devices. For more information see "Capacitor Marking".
2 _{The 2mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case}
size devices. For more information regarding 2mm pitch option see "Tape & Reel Packaging Information".
3 _{Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel}
Packaging Quantities" and "Tape & Reel Packaging Information".
3 _{For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information".}
3 _{All Automotive packaging C-Specs listed exclude the option to laser mark components. The option to laser mark is not available on these devices. For}
more information see "Capacitor Marking".
Dimensions – Millimeters (Inches)
W
T
L
B
S
EIA Size
Code
Metric Size
Code
L
Length
W
Width
T
B
Thickness Bandwidth
Without Flexible Termination
0603
1608
1.60 (0.063)
±0.15 (0.006)
0.80 (0.032) See Table 2 for 0.35 (0.014)
±0.15 (0.006)
Thickness
±0.15 (0.006)
0603
1608
1.60 (0.063)
±0.17 (0.007)
With Flexible Termination
0.80 (0.032) See Table 2 for
±0.15 (0.006)
Thickness
0.45 (0.018)
±0.15 (0.006)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
S
Separation
Minimum
Mounting
Technique
0.70 (0.028)
Solder Wave or
Solder Reflow
0.58 (0.023)
Solder Wave or
Solder Reflow
C1091_C0G_ESD • 12/5/2016 3