C0603C104J3RECAUTO Datasheet, PDF (8/18 Pages) Kemet Corporation – Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),
convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal
stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-
STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at
these conditions.
Profile Feature
Preheat/Soak
Temperature Minimum (T_Smin)
Temperature Maximum (T_Smax)
Time (t_S) from T_Smin to T_Smax
Ramp-Up Rate (T_L to T_P)
Liquidous Temperature (T_L)
Time Above Liquidous (t_L)
Peak Temperature (T_P)
Time Within 5°C of Maximum Peak
Temperature (t_P)
Ramp-Down Rate (T_P to T_L)
Termination Finish
100% Matte Sn
150°C
200°C
60 – 120 seconds
3°C/second maximum
217°C
60 – 150 seconds
260°C
30 seconds maximum
6°C/second maximum
Time 25°C to Peak Temperature
8 minutes maximum
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
T_{P Maximum Ramp Up Rate = 3ºC/sec}
t_P
Maximum Ramp Down Rate = 6ºC/sec
T_L
t_L
T_smax
T_smin
t_s
25
25ºC to Peak
Time
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1091_C0G_ESD • 12/5/2016 8