IS64LV25616AL Datasheet, PDF (14/14 Pages) Integrated Silicon Solution, Inc – 256K x 16 HIGH SPEED ASYNCHRONOUS CMOS STATIC RAM WITH 3.3V SUPPLY

PACKAGING INFORMATION
Plastic TSOP
Package Code: T (Type II)
ISSI^®
N
1
D
ZD
.
e
N/2+1
E1 ^E
N/2
Notes:
1. Controlling dimension: millimieters,
unless otherwise specified.
2. BSC = Basic lead spacing
between centers.
3. Dimensions D and E1 do not
include mold flash protrusions and
should be measured from the
bottom of the package.
4. Formed leads shall be planar with
respect to one another within
0.004 inches at the seating plane.
SEATING PLANE
A
b
A1
L
α
C
Millimeters
Inches
Symbol Min Max Min Max
Ref. Std.
No. Leads (N)
32
A — 1.20 — 0.047
A1
0.05 0.15 0.002 0.006
b
0.30 0.52 0.012 0.020
C
0.12 0.21 0.005 0.008
D 20.82 21.08 0.820 0.830
E1 10.03 10.29 0.391 0.400
E 11.56 11.96 0.451 0.466
e
1.27 BSC
0.050 BSC
L
0.40 0.60 0.016 0.024
ZD
0.95 REF
0.037 REF
α
0° 5°
0° 5°
Plastic TSOP (T - Type II)
Millimeters
Inches
Min Max Min Max
44
— 1.20
0.05 0.15
0.30 0.45
0.12 0.21
18.31 18.52
10.03 10.29
11.56 11.96
0.80 BSC
0.41 0.60
0.81 REF
0° 5°
— 0.047
0.002 0.006
0.012 0.018
0.005 0.008
0.721 0.729
0.395 0.405
0.455 0.471
0.032 BSC
0.016 0.024
0.032 REF
0° 5°
Millimeters
Min Max
Inches
Min Max
50
— 1.20 — 0.047
0.05 0.15 0.002 0.006
0.30 0.45 0.012 0.018
0.12 0.21 0.005 0.008
20.82 21.08 0.820 0.830
10.03 10.29 0.395 0.405
11.56 11.96 0.455 0.471
0.80 BSC
0.031 BSC
0.40 0.60 0.016 0.024
0.88 REF
0.035 REF
0° 5°
0° 5°
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
06/18/03